As the integration of electronic functions into everyday objects continues to grow, the environmental impact of printed circuit boards (PCBs) has become a critical concern with a significant increase in global electronic waste (E-waste).
The life cycle assessment (LCA) comparing conventional PCB with printed PCB shows that additive printing processes represent a more sustainable solution to replace conventional fabrication techniques. Utilizing additive manufacturing techniques, we have developed a four-metal layer flexible printed PCB. This innovative PCB features over 100 thru-hole vias, 90 surface-mount device (SMD) components on both sides, and integrates radio frequency (RF) functionalities. These advancements demonstrate the potential for high-performance PCBs produced with significantly lower environmental impact.

Our approach expands the application of printed PCBs beyond niche markets, and highlights the importance of sustainable practices in electronics manufacturing.

After receiving her PhD degree in microelectronics from Université Grenoble-Alpes and CEA-Leti in 2019, she joined CEA-Liten focusing on organic electronics technologies such as organic thin film transistors and printing technologies. She is currently leading the demonstrator development team and serves as both project and task leader for several EU-funded projects. Her current research interests include developing sustainable and environmental friendly alternatives to conventional electronics using printed electronics technologies.