When we first introduced photonic curing in 2004, we were focused on the rapid sintering of nanometal inks on plastic and paper foils. As the technology has advanced, more commercial applications have emerged.

This talk will explore two new applications of photonic curing which operate in two different regimes: Photonic debond and photonic reflow.

Photonic debond uses high instantaneous radiant power to debond temporarily bonded semiconductor wafers for the semiconductor packaging industry. Photonic reflow, uses high average radiant power to solder components to boards for the SMT industry. In both cases, the pulsed nature of the process has reduced thermal budget and can outperform traditional processes. Additional applications related to batteries and photovoltaics will be discussed as well.

Stan has been bringing deep-tech innovation to markets and applications for over 20 years. He is a founding member of PulseForge/NovaCentrix/Nanotechnologies going back to the year 2000, when the team originally was focused on nanomaterial synthesis and applications. During this time he has led market and application growth in electronics, biomed, and semiconductor applications. To date, millions of people have been directly and positively impacted through use and applications of their products in wound care, and printed and flexible electronics. Greater than 600 million consumer devices have been produced using PulseForge tools in factories around the world.

For the past 10 years he has been very active with the OE-A, the leading international association for printed and large-area flexible electronics, where he is currently wrapping up his second term as elected Chairman.

He has a masters degree in mechanical engineering from the University of Texas in Austin, and a bachelors degree in mechanical engineering from Rice University in Houston, Texas.