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Empa-Akademie, Dübendorf, Switzerland
September 25-26, 2024
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Dr Danick Briand Ecole Polytechnique Fédérale de Lausanne (EPFL), School of Engineering. Institute of Mechanical Engineering, Soft Transducers Laboratory (LMTS) (Switzerland)
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A holistic approach for the circular production of disposable smart electronics
Abstract :
As of 2022, global electronic waste has reached close to 60 million metric tons annually. Furthermore, less than 25% of the electronic devices that often rely on printed circuit boards made of toxic materials are recycled. With a projected doubling of the number of Internet-of-things products by 2030, developing environmentally friendly and non-toxic electronics and sensing alternatives would be an impactful solution to the growing electronic waste issue.
Research is required to fully exploit printed electronics capabilities to reach more sustainable electronic and sensing systems, targeting a higher level of circularity. Additive manufacturing of eco-friendly and renewable materials is a promising approach for the development of greener electronic systems by enabling, after service life, their ecoresorbability and/or recyclability. However, this represents important scientific and technical challenges in comparison to the established technologies, the transient materials being inherently reactive to the environment. Our original approach relies on the embedding degradable metallic traces within bio-sourced substrates and dielectrics using additive manufacturing (AM) processes to generate more sustainable smart labels. We will show some examples of fully printed wireless and chipless tags and sensors made of compostable bio-polymers and recyclable paper substrates, with the implementation of eco-friendly encapsulation and sensing layers.
Bio :
Danick Briand received his B.Eng. degree and M.A.Sc. degree in engineering physics from École Polytechnique in Montréal, Canada, in collaboration with the Institut National Polytechnique de Grenoble (INPG), France, in 1995 and 1997, respectively. He obtained his Ph.D. degree in the field of micro-chemical sensing systems from the Institute of Microtechnology (IMT), University of Neuchâtel, Switzerland in 2001. He is currently the team leader of the MEMS and Printed Microsystems group at the Soft Transducers Laboratory (LMTS) from the Ecole Polytechnique Fédérale de Lausanne (EPFL).
He has been awarded the Eurosensors Fellowship in 2010 for his pioneer research on printed and flexible sensors. He is member of the scientific and technical committees of various conferences if the field of sensors, MEMS and printed electronics. He has been author or co-author on more than 275 papers published in scientific journals and conference proceedings. His research interests include 3D structural electronics, digital manufacturing of smart systems, soft microsystems technologies, and sustainable electronic and sensor technologies.