Mr. Michael Greenish

TactoTek, Finland

Merging Form and Function with Injection Molded Structural Electronics

Abstract :

TactoTek Injection Molded Structural Electronics™ (IMSE™) is a revolutionary technology that integrates printed electronics (circuitry, sensors, and antennas) and discrete electronic components (LEDs, ICs, etc.) inside of thin 3D plastic structures, significantly reducing the thickness and weight of parts and allowing the delivery of excellent touch and antenna performance while brings unique design opportunities for the next generation of HMIs. Other benefits include simplified assembly and reduced total cost of ownership.


Bio :

Michael Greenish received his B. Mechanical Engineering in 1997 from McGill University. He worked 6 years in research and development of batteries for electric vehicles with forerunners AeroVironment and EnergyCS. He then worked 8 years first as field applications engineer and then business development manager for haptic technology leader Immersion Corporation. He has been working 3 years as Sales Manager for Finnish in-mold electronics technology leader TactoTek Oy.